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PEEK

-Definition: It is an aromatic semi crystalline linear thermoplastic polymer composed of repeating units of polyaryletherketone, with benzene rings, ether bonds, and carbonyl groups on the molecular chain.

characteristic

-High temperature resistance: The melting point is 343 ℃, the glass transition temperature is 143 ℃, the long-term use temperature can reach up to 260 ℃, the instantaneous use temperature can reach 300 ℃, and it hardly decomposes in a short time at 400 ℃.

-Mechanical properties: The tensile strength is above 90MPa, with high elastic modulus, high hardness, impact resistance, and creep resistance, and can still maintain high strength at high temperatures.

-Wear resistance: It has a certain degree of self-lubricating performance and a low friction coefficient, with extremely low wear rate and excellent resistance to sliding wear and micro motion wear.

-Corrosion resistance: It has excellent resistance to various organic solvents, oils, weak acids, and weak bases, and is almost insoluble in other acids, bases, and organic solvents except for concentrated sulfuric acid.

Preparation Method

-Industrial preparation method: PEEK is synthesized by heating, stirring, and condensing equimolar amounts of 4,4 '- difluorobenzophenone and hydroquinone in solvent diphenyl sulfone under the action of sodium containing inorganic salts, potassium carbonate, bicarbonate, or high alkali metal carbonate catalysts between 180 ° C and 320 ° C. The product is washed with acetone and water to obtain PEEK.

-Preparation by electrophilic substitution: such as dissolution and condensation of 4- (4-phenoxy) benzoic acid in fluoroalkyl sulfonic acid, or reaction and condensation of 1,4-diphenyloxybenzene and 1,4-di (4-carboxy) phenoxybenzene in fluoroalkyl sulfonic acid, followed by treatment with sodium hydroxide solution and other steps.

-Nucleophilic substitution preparation: Dibasic metal salts of diphenols can be prepared by reacting dihalogenated benzene compounds with electron withdrawing groups in the ortho or para position under anhydrous conditions using dimethyl sulfoxide as a solvent, or by condensation reaction between 4,4 '- difluorobenzophenone and bis (trimethylsilyl) derivatives of hydroquinone at 220-320 ℃.

application area 

-Aerospace field: Can replace aluminum and other metals in manufacturing aircraft components, such as engine parts, external rainwater resistant parts, etc.

-In the automotive industry, it is used to manufacture engine covers, bearings, gaskets, seals, clutch rings, and other components, and is applied in the transmission, braking, and air conditioning systems of automobiles.

-In the field of electronics and electrical appliances, it is an ideal electrical insulator that can manufacture pipelines, valves, and pumps for transporting ultrapure water. In the semiconductor industry, it can also manufacture wafer carriers, electronic insulation films, and various connecting devices.

-In the medical field, due to its good biocompatibility, non toxicity, and resistance to repeated high-pressure sterilization, it is used to manufacture endoscope parts, dental descaling devices, artificial bone materials, etc., as well as liquid chromatography columns, tubes, accessories, etc. for instrument analysis.